That material is "Potting" and is a plasticine, non-conductive filler to provide insulation and vibration resistance. It gets into nearly every void so it will stick to, around and under every component in the case.
Removing potting material is RISKY at best. since it gets into everything you will most likely tear up or pull at the connections as you try to remove it from the components. Recommend contacting the device manufacturer to see if they will sell you a base (or pre-potted) device, then you can handle the packaging yourself.
Toad,
chacha is in the right neighborhood with his statement. There are many different types of epoxies. They are NOT all a "non-conductive", encapsulating epoxies though, but that "IS" what you will want "Non-Conductive, Encapsulating Epoxy". It comes mostly in a two part mix, just like many other epoxies, and is poured into whatever you might wish soon after being mixed. It will fill every void and adhere to everything it comes into contact with and dries to different selections of density (hardness), I do NOT recommend semi-hard (silicon based epoxies) or SOFT epoxies. Select a "hard" cure for the best results in both shock resistance and for weather resistant applications. :2thumbs:
Available on the net, most likely in search areas of "Electronic Encapsulating Epoxies".
Just remember what Chacha said about any type of removal, "The internal devises will most likely get totally trashed during any attempts of epoxy removal" whether physical or chemical induced!
Good Luck! Hope this Helps! :2thumbs:
dead
